Circuit Board Having Interposer Embedded Therein, Electronic Module Using Same, and Method for Manufacturing Same
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United States of America Patent
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Issued Date -
Dec 10, 2015
app pub date -
Jul 24, 2013
filing date -
Dec 26, 2012
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Abstract
The present invention relates to a circuit board having an interposer embedded therein, including: an interposer, the top side and back side of which are electrically connected by a first through-electrode; and a molding member having the interposer embedded therein and the top side and back side of the interposer exposed. According to the present invention, the molding member of an insulator and the interposer of a semiconductor can be appropriately selected and coupled according to the required fine pitch of a through-hole, and the interposer is molded on substantially the same level as a semiconductor chip, and thus no additional process for embedding the interposer needs to be added.
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