BASE FILM FOR DICING SHEET AND DICING SHEET COMPRISING SAME

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United States of America Patent

APP PUB NO 20150357225A1
SERIAL NO

14760220

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A base film for a dicing sheet is provided which can suppress dicing debris from generating during the dicing of a cut object in the full-cut dicing without imparting physical energy, such as electron beam or γ ray, and which has an enhanced expanding property in the expanding process. The base film for a dicing sheet comprises a resin layer that contains a polyethylene and an ethylene-tetracyclododecene copolymer. A dicing sheet that comprises the base film for a dicing sheet is also provided.

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Patent Owner(s)

Patent OwnerAddress
LINTEC CORPORATION23-23 HONCHO ITABASHI-KU TOKYO 1730001

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ITO, Masaharu Tokyo, JP 100 760
TAYA, Naoki Tokyo, JP 46 111
UEDA, Masashi Tokyo, JP 146 1378

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