WARPED SILICON-CHIP ADSORPTION DEVICE AND ADSORPTION METHOD THEREOF
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United States of America Patent
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Issued Date -
Dec 10, 2015
app pub date -
Dec 26, 2013
filing date -
Dec 28, 2012
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
An apparatus and method for adsorbing a wafer are disclosed. The apparatus includes a chuck (100) for vacuum adsorption of the wafer and at least three suction head assemblies (200). The chuck (100) has at least three openings (101) corresponding to the suction head assemblies (200). The suction head assembly (200) includes: a pneumatic cylinder (230) in fixed connection with the chuck (100); and a nozzle (230) in movable connection to the pneumatic cylinder (210). The nozzles (230) are completely located within the respective openings (101) or at least partially above a surface of the chuck (100). Through increasing at least three suction head assemblies (200) in the chuck (100), the wafer (300) can be adsorbed and stretched by the suction head assembly (200) until the lower surface of the wafer (300) is attached to the upper surface of the chuck 100, thereby achieving the adsorption of the wafer (300).
First Claim
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