HEATING DEVICE FOR HOT STAMPING

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20150352621A1
SERIAL NO

14759771

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A heating device for hot stamping is configured to heat a plated metallic material while conveying the plated metallic material. The heating device for hot stamping comprises: a first heating tank provided in a conveyance path for the plated metallic material; and a second heating tank provided downstream of the first heating tank in the conveyance path. A heating amount provided by the second heating tank is configured such that a temperature of the plated metallic material becomes equal to or higher than Ac3 point and less than a boiling point of a plating of the plated metallic material, and a heating amount provided by the first heating tank is configured to be larger than the heating amount provide by the second heating tank.

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Patent Owner(s)

Patent OwnerAddress
FUTABA INDUSTRIAL CO LTDAICHI

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kamiya, Yoshihiro Okazaki-shi, Aichi, JP 6 133

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