HEAT DISSIPATION STRUCTURE AND SYNTHESIZING METHOD THEREOF

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United States of America Patent

SERIAL NO

14612934

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Abstract

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A heat dissipation structure and a synthesizing method thereof are provided by the present disclosure. The method comprises: providing a metal foil; forming a deposition substrate on a first surface of the metal foil, wherein the deposition substrate includes a barrier layer disposed on the metal foil and a catalyst layer disposed on the barrier layer, such that catalyst in the catalyst layer is prevented from diffusing into the metal foil; and synthesizing a carbon nanotube array on the deposition substrate formed on the first surface. The method provided by the present disclosure can increase density of the CNTs in the heat dissipation structure.

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Patent Owner(s)

Patent OwnerAddress
HUAWEI TECHNOLOGIES CO LTD518129 BANTIAN HUAWEI HEADQUARTERS OFFICE BUILDING LONGGANG DISTRICT GUANGDONG SHENZHEN SHENZHEN CITY GUANGDONG PROVINCE 518129
WASEDA UNIVERSITY104 TOTSUKAMACHI 1-CHOME SHINJUKU-KU TOKYO 1698050 ?1698050

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
NA, Nuri Tokyo, JP 1 3
NIHEI, Mizuhisa Yokohama, JP 26 305
NODA, Suguru Tokyo, JP 32 152

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