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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
THE ARIZONA BOARD OF REGENTS A BODY CORPORATE ACTING FOR AND ON BEHALF OF ARIZONA STATE UNIVERSITY	1475 NORTH SCOTTSDALE ROAD SKYSONG SUITE 200 SCOTTSDALE AS 85257-9908

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
• H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....

• 2015 Application Filing Year
• H01L Class
• 25498 Applications Filed
• 22451 Patents Issued To-Date
• 88.06 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
O'Rourke, Shawn	Tempe, US	11	238
# of filed Patents : 11 Total Citations : 238

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Patent Citation Ranking

• 1 Citation Count
• H01L Class

• 10.46 % this patent is cited more than
• 10 Age

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Fee	Large entity fee	small entity fee	micro entity fee	due date
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Jun 3, 2027

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2015/0348,935

Method of Temporarily Attaching a Rigid Carrier to a Substrate

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Abstract

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Method for temporarily attaching a substrates to a rigid carrier is described which includes forming a sacrificial layer of a thermally-decomposable polymer, e.g., poly(alkylene carbonate), and bonding the flexible substrate to the rigid carrier with the sacrificial layer positioned therebetween. Electronic components and/or circuits may then be fabricated or other semiconductor processing steps employed (e.g., backgrinding) on the attached substrate. Once fabrication is completed, the substrate may be detached from the rigid carrier by heating the assembly to decompose the sacrificial layer.

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Description

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Claims

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