3DIC Interconnect Devices and Methods of Forming Same
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United States of America Patent
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Issued Date -
Dec 3, 2015
app pub date -
Aug 25, 2014
filing date -
May 29, 2014
priority date (Note) -
Abandoned
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Abstract
An interconnect device and a method of forming the interconnect device are provided. Two integrated circuits are bonded together. A first opening is formed through one of the substrates. One or more dielectric films are formed along sidewalls of the first opening. A second opening is formed extending from the first opening to pads in the integrated circuits, while using some of the pads as hard masks. The first opening and the second opening are filled with a conductive material to form a conductive plug.
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