METHOD OF MANUFACTURING MICROSTRUCTURES OF METAL LINES
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United States of America Patent
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Issued Date -
Dec 3, 2015
app pub date -
Jul 11, 2014
filing date -
May 28, 2014
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Abandoned
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Abstract
A method of manufacturing a metal line microstructure is provided. Firstly, a substrate is provided. Then, a seed layer is formed on a surface of the substrate. Then, a photoresist layer is formed on a surface of the seed layer, and a photolithography and etching process is performed to form a trench in the photoresist layer, wherein the trench has a specified width. Then, an electroplating process is performed to fill a conductive layer into the trench. Afterwards, the photoresist layer and a portion of the seed layer uncovered by the conductive layer are removed, so that the metal line microstructure is produced.
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