THERMALLY-CONDUCTIVE, ELECTRICALLY-CONDUCTIVE ADHESIVE COMPOSITION
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United States of America Patent
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N/A
Issued Date -
Dec 3, 2015
app pub date -
Dec 25, 2013
filing date -
Dec 27, 2012
priority date (Note) -
Published
status (Latency Note)
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Abstract
The invention relates to a thermally conductive, electrically conductive adhesive composition including:
- (A) an electrically conductive filler,(B) an epoxy resin, and(C) a curing agent.The electrically conductive filler (A) is a submicron fine silver powder, and the content of the fine silver powder is 75 to 94% by mass of the total amount of the adhesive composition. The content of the epoxy resin (B) is 5 to 20% by mass of the total amount of the adhesive composition. The curing agent (C) is a compound of Formula (I), (II), or (III), as defined herein, and the content of the compound is 0.4 to 2.4 molar equivalents in terms of equivalent of active hydrogen relative to 1 molar equivalent of epoxy groups in the epoxy resin (B).
First Claim
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