POLISHING PAD PRODUCTION METHOD
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United States of America Patent
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Issued Date -
Dec 3, 2015
app pub date -
Oct 18, 2013
filing date -
Dec 28, 2012
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Abandoned
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Abstract
The present invention includes a polishing pad production method comprising a step of forming one or more grooves in a surface of a polishing layer comprising a flexible polyurethane foam, wherein the flexible polyurethane foam has an Asker D hardness of 30 or less at 25° C., and the step comprises a step 1 of cooling the polishing layer to adjust the Asker D hardness of the flexible polyurethane foam to 35 or more, and a step 2 of forming one or more grooves in the surface of the polishing layer comprising the flexible polyurethane foam, the Asker D hardness of which has been adjusted by the cooling. According to the polishing pad production method of the present invention, it is possible to provide a polishing pad production method capable of performing grooving in a polishing layer with a high precision when the polishing layer comprises a flexible polyurethane foam.
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