SOFT POLISHING PAD FOR POLISHING A SEMICONDUCTOR SUBSTRATE

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United States of America Patent

SERIAL NO

14823956

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Abstract

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Soft polishing pads for polishing semiconductor substrates are described. A soft polishing pad includes a molded homogeneous polishing body having a thermoset, closed cell polyurethane material with a hardness approximately in the range of 20 Shore D to 45 Shore D.

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Patent Owner(s)

Patent OwnerAddress
CABOT MICROELECTRONICS CORPORATION870 NORTH COMMONS DRIVE AURORA IL 60504

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Allison, William C Beaverton, US 49 675
Frentzel, Richard Murrieta, US 12 251
Huang, Ping St. Louis Park, US 167 2528
Kerprich, Robert Portland, US 15 409
Scott, Diane Portland, US 51 937

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