Assembly comprising a hyperfrequency component and a printed circuit
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United States of America Patent
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Jan 9, 2018
Issued Date -
N/A
app pub date -
May 21, 2015
filing date -
May 23, 2014
priority date (Note) -
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Abstract
The inventive assembly comprises a hyperfrequency component of the surface-mounted component type including at least one first hyperfrequency transmission line, as well as a printed circuit board including at least one second hyperfrequency transmission line able to be put in contact with the first hyperfrequency transmission line. The component comprises an enclosure with a face in contact with the printed circuit board, which includes at least one cavity for confining a hyperfrequency signal, delimited by conductive surfaces of the enclosure, and by a conductive zone of the second hyperfrequency transmission line.
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