STACKED DIE PACKAGE WITH REDISTRIBUTION LAYER
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United States of America Patent
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Issued Date -
Nov 26, 2015
app pub date -
May 20, 2014
filing date -
May 20, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A packaged semiconductor device has lead fingers that define a cavity, and a first die located within the cavity. A second die abuts an inactive side of the first die. The second die is electrically connected to one or more of the lead fingers. A redistribution layer abuts an active side of the first die. Metal structures are situated on an outer surface of the redistribution layer. The redistribution layer electrically connects (i) one or more of the metal structures to one or more of the lead fingers and (ii) one or more of the metal structures to one or more bond pads on the active side of the first die.
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