III NITRIDE EPITAXIAL SUBSTRATE AND METHOD OF PRODUCING THE SAME

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United States of America Patent

APP PUB NO 20150340230A1
SERIAL NO

14759128

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Abstract

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A III nitride epitaxial substrate with reduced warp after the formation of a main laminate and improved vertical breakdown voltage, and a method of producing the same, a III nitride epitaxial substrate includes: a Si substrate; an initial layer in contact with the Si substrate; and a superlattice laminate formed on the initial layer, the superlattice laminate including first layers made of AlαGa1-αN (0.5<α≦1) and second layers made of AlβGa1-βN (0<β≦0.5) that are alternately stacked, in which a composition ratio β of the second layers gradually increases as a distance from the Si substrate increases.

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DOWA ELECTRONICS MATERIALS CO LTDTOKYO TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
IKUTA, Tetsuya Akita-shi, JP 47 555
SHIBATA, Tomohiko Akita-shi, JP 79 630

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