TOUCH PANEL AND WIRING STRUCTURE AND METHOD FOR FORMING WIRING STRUCTURE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20150338972A1
SERIAL NO

14716135

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A touch panel includes a substrate, a conductive sensing layer, an insulation layer and a conductive line layer. The substrate includes a central portion and a first peripheral portion. The conductive sensing layer is disposed on the central portion. The insulation layer includes a second peripheral portion, wherein the second peripheral portion has a trench structure and is disposed on the first peripheral portion. The conductive line layer is disposed in the trench structure, and is electrically connected to the conductive sensing layer. A wiring structure and a method for forming a wiring structure are also provided.

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Patent Owner(s)

Patent OwnerAddress
HENGHAO TECHNOLOGY CO LTDNO 2-1 WENHUA RD HSINCHU INDUSTRIAL PARK HUKOU TOWNSHIP HSINCHU COUNTY 30352

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Peng, Chun-Ming Hsinchu County, TW 2 2
Wong, Ching-Fang Hsinchu County, TW 15 36

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