SUPPORT FOR USE IN MICROCHANNEL PROCESSING
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United States of America Patent
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Issued Date -
Nov 26, 2015
app pub date -
Jul 1, 2015
filing date -
May 25, 2005
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Abstract
The disclosed technology relates to an apparatus, comprising: at least one microchannel, the microchannel comprising at least one heat transfer wall; a porous thermally conductive support in the microchannel in contact with the heat transfer wall; a catalyst or a sorption medium supported by the porous support; and a heat source and/or heat sink in thermal contact with the heat transfer wall.
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