THERMAL INTERFACE MATERIALS WITH THIN FILM SEALANTS
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United States of America Patent
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N/A
Issued Date -
Nov 19, 2015
app pub date -
Jun 24, 2014
filing date -
May 19, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In an exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side. A dry material is along at least a portion of the first side of the thermal interface material. The dry material has a thickness less than 0.005 millimeters. At least one edge of the thermal interface material is sealed at least partially by the dry material.
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Cited Art Landscape
Patent Citation Ranking
- 17 Citation Count
- H05K Class
- 69.32 % this patent is cited more than
- 10 Age