CIRCUIT BOARD, IMAGE SENSOR UNIT, IMAGE READING APPARATUS, AND IMAGE FORMING APPARATUS
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United States of America Patent
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Issued Date -
Nov 19, 2015
app pub date -
Apr 28, 2015
filing date -
May 16, 2014
priority date (Note) -
Abandoned
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Abstract
A circuit board includes: a printed board including SWB pads for wire bonding and lands; image sensor ICs mounted on the printed board by a thermosetting adhesive and including FWB pads for wire bonding to be electrically connected to the SWB pads by wire bonding; and surface-mount elements mounted on the lands by soldering, wherein the surface-mount elements and the lands are connected by solders including bromine-containing flux, and coating films are formed on surfaces of the solders to prevent attachment of bromine to the SWB pads and the FWB pads.
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