SOLDERABLE PAD FABRICATION FOR MICROELECTRONIC COMPONENTS
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United States of America Patent
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Issued Date -
Nov 19, 2015
app pub date -
Jul 28, 2015
filing date -
Apr 23, 2012
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Abandoned
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Abstract
Two microelectronic components can be attached by flowing solder between solderable pads patterned on interfacing surfaces. According to one implementation, the microelectronic components can include the solderable pads patterned onto first respective surfaces and other surface features patterned onto second respective surfaces. In another implementation, the solderable pads can include an adhesion layer, a diffusion barrier layer, and a surface oxidation layer.
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