SEMICONDUCTOR DEVICE PACKAGE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Nov 19, 2015
app pub date -
Apr 16, 2013
filing date -
Dec 17, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A package for a semiconductor device having a fan-out structure in which input/output terminals are disposed adjacent to at least one first semiconductor chip and electrically connected to the at least one first semiconductor chip may include a second semiconductor chip spaced apart from the input/output terminals and be opposed to the at least one first semiconductor chip. The semiconductor device package may ensure an improved degree of integration and may improve connection stability between the input/output terminals and wirings. Accordingly, a reliability of the semiconductor device package may be enhanced.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully