PACKAGE SUBSTRATE AND METHOD FOR FABRICATING THE SAME
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United States of America Patent
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Issued Date -
Nov 19, 2015
app pub date -
Aug 14, 2014
filing date -
May 13, 2014
priority date (Note) -
Abandoned
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Abstract
A package substrate and a method of fabricating the same are provided. The method includes providing a substrate body having a first surface, a second surface opposing the first surface, a plurality of first electrical connecting pads disposed on the first surface; mounting a metal board on the first electrical connecting pads; and patterning the metal board so as to define a plurality of metal pillars corresponding to the first electrical connecting pads. Therefore, drawbacks of raw edges and unequal heights of the metal pillars can be obviated.
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