ELECTRONIC DEVICE INCLUDING COMPONENTS IN COMPONENT RECEIVING CAVITY AND RELATED METHODS
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United States of America Patent
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Issued Date -
Nov 19, 2015
app pub date -
May 15, 2014
filing date -
May 15, 2014
priority date (Note) -
Abandoned
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Abstract
An electronic device may include a surface mount integrated circuit (IC) package to be attached to a printed circuit board (PCB). The surface mount IC package may include at least one IC and an encapsulating material surrounding the at least one IC and having a component receiving cavity defined therein on a bottom surface thereof to be positioned adjacent the PCB. The surface mount IC package may also include electrical leads coupled to the at least one IC and extending outwardly from the encapsulating material to be coupled to the PCB. The electronic device may also include at least one electronic component carried within the component receiving cavity and that includes electrical contacts to be coupled to the PCB.
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