Semiconductor Package with Multiple Dies
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United States of America Patent
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app pub date -
May 20, 2015
filing date -
Feb 27, 2007
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Abandoned
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Abstract
A semiconductor package that includes a substrate having a metallic back plate, an insulation body and a plurality of conductive pads on the insulation body, and a semiconductor die coupled to said conductive pads, the conductive pads including regions readied for direct connection to pads external to the package using a conductive adhesive.
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