METHOD OF PROCESSING WAFER
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United States of America Patent
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Issued Date -
Nov 19, 2015
app pub date -
May 15, 2015
filing date -
May 16, 2014
priority date (Note) -
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Abstract
A wafer has a device region on a front surface where a plurality of devices are disposed and an outer circumferential excess region surrounding the device region. The wafer has a chamfered portion of arcuate cross section on an outer circumferential edge thereof, the chamfered portion extending from the front surface to a reverse side of the wafer. A sheet having an adhering capability and tack strength with respect to the wafer is applied to the front surface of the wafer with an adhesive placed on the outer circumferential excess region. Then a cutting blade cuts into the chamfered portion by a predetermined depth from the front surface of the wafer, and the wafer is cut along the outer circumferential edge thereof to remove part of the chamfered portion and keep part of the adhesive adjacent to at least the device region unremoved.
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