CURABLE RESIN COMPOSITION, INSULATING FILM, PREPREG, CURED PRODUCT, COMPOSITE, AND SUBSTRATE FOR ELECTRONIC MATERIAL

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United States of America Patent

SERIAL NO

14651913

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Abstract

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Disclosed is a curable resin composition including: a phosphorus-containing epoxy compound (A2) having a structure represented by formula (1) or (2) below; and a filler (A3),

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Patent Owner(s)

Patent OwnerAddress
ZEON CORPORATION6-2 MARUNOUCHI 1-CHOME CHIYODA-KU TOKYO 1008246

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hayakawa, Shuhei Chiyoda-ku, Tokyo, JP 6 34
Hayashi, Yuki Chiyoda-ku, Tokyo, JP 136 585

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