DEVICE PACKAGE AND METHODS FOR THE FABRICATION THEREOF
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United States of America Patent
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Issued Date -
Nov 12, 2015
app pub date -
Jan 21, 2015
filing date -
Sep 20, 2010
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Abandoned
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Abstract
A microwave assembly having a substrate comprising a microwave device; said device having a die, a first layer having a dielectric constant between about 1.00 and about 1.45 and a thickness between about 0.05 and about 2 mm along with one or more layers chosen from an absorbing layer, an EMI blocking layer, a layer comprising conductive material or a metal cover.
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