SUBSTRATE WITH A LOW DIELECTRIC CONSTANT MATERIAL AND METHOD OF MOLDING
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Nov 12, 2015
app pub date -
May 6, 2014
filing date -
May 6, 2014
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Connectors and/or substrates which are made utilizing a low dielectric constant injection moldable polymer or other melt processable polymer, such as, but not limited to, thermoplastic material, thermoplastic composite material, thermoset material, thermoset composite material or a combination thereof. The low dielectric constant injection moldable polymer or other melt processable polymer support noise and/or crosstalk reductions for high speed signal transmission. The low dielectric constant material provides dielectric shielding between adjacent high speed signal lines. The reduced dielectric constant and reduced loss-tangent is created by forming voids or pores within the bulk plastic material, thus increasing the air, gas or void content, and thus decreasing the density and overall dielectric constant of such material. The porosity thus introduced into the shielding between adjacent transmission lines reduces crosstalk and other losses, and thus maintains signal integrity in connector/substrate designs.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully