INTEGRATED CIRCUIT
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United States of America Patent
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Issued Date -
Nov 12, 2015
app pub date -
Apr 28, 2015
filing date -
Apr 28, 2014
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An integrated circuit (IC) is provided. The IC includes a chip, a passivation layer, a first metal internal connection, a routing wire and a bonding area. The passivation layer is disposed on the chip, wherein the passivation layer has a first opening. The first metal internal connection is disposed under the passivation layer and disposed in the chip. The routing wire is disposed on the passivation layer, wherein a first end of the routing wire electrically connects to a first end of the first metal internal connection through the first opening of the passivation layer. The bonding area is disposed on the passivation layer, wherein the bonding area electrically connects to a second end of the routing wire.
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