CORELESS PACKAGING SUBSTRATE, POP STRUCTURE, AND METHODS FOR FABRICATING THE SAME
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United States of America Patent
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Issued Date -
Nov 12, 2015
app pub date -
Aug 20, 2014
filing date -
May 9, 2014
priority date (Note) -
Abandoned
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Abstract
A method for fabricating a coreless packaging substrate is provided, which includes: forming a dielectric layer on a conductive plate having a plurality of conductive pads; forming a circuit layer on the dielectric layer and forming in the dielectric layer a plurality of conductive vias that electrically connect the circuit layer and the conductive pads; and removing a portion of the conductive plate so as to cause the remaining portion of the conductive plate to form a plurality of conductive elements, thereby dispensing with a core layer and reducing the material and fabrication cost.
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