DYNAMIC MEASUREMENT OF MATERIAL PROPERTIES USING TERAHERTZ RADIATION WITH REAL-TIME THICKNESS MEASUREMENT FOR PROCESS CONTROL
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United States of America Patent
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Jul 17, 2014
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May 8, 2014
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Abstract
A method of determining material properties for an object under test is disclosed. The method comprises determining a thickness at a point on the object under test in a non-invasive manner. It also comprises obtaining a terahertz measurement by passing terahertz radiation through the object under test using a terahertz emitter and detecting the terahertz radiation using a terahertz detector. Finally, it comprises determining an optical property at the point on the object under test using a measurement value from the terahertz emitter and the terahertz detector and a measured value for the thickness at the point.
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