POLISHING COMPOSITION

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United States of America Patent

APP PUB NO 20150322294A1
SERIAL NO

14655597

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided is a polishing composition which can suppress scratches on the surface of a metal substrate as an object to be polished, while suppressing dishing of the metal substrate. Disclosed is a polishing composition including functional polishing particles and water, the functional polishing particles containing a surface-modifying group having, at one end, a functional group that suppresses dissolution of a metal substrate by adsorbing to the metal substrate, and metal oxide particles to which the surface-modifying group is immobilized.

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Patent Owner(s)

Patent OwnerAddress
FUJIMI INCORPORATEDKIYOSU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ONISHI, Shogo Kiyosu-shi, Aichi, JP 42 88

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