NANOCOMPOSITE RESIN COMPOSITION
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United States of America Patent
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Issued Date -
Nov 12, 2015
app pub date -
May 12, 2014
filing date -
May 12, 2014
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Abstract
A nanocomposite resin composition having improved heat resistance, higher glass transition temperature, and excellent mechanical characteristics and thermal conductivity and cured nanocomposite resin material are disclosed. The resin composition comprises a thermosetting resin and/or a thermoplastic resin, a silane coupling agent, and an inorganic filler. The inorganic filler includes an inorganic filler with a particle diameter or long diameter of 1 nm to 99 nm and an inorganic filler with a particle diameter or long diameter of 100 nm to 100 μm. At least one of these inorganic fillers is formed of SiO2-coated inorganic particles in which a coat of SiO2 is formed on the surface of inorganic particles of AlN, a metal oxide selected from the group consisting of Al2O3, MgO and TiO2, or a mixture of these.
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