MODULE AND METHOD FOR PRODUCING MODULE
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United States of America Patent
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app pub date -
Jul 13, 2015
filing date -
Jan 16, 2013
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Abandoned
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Abstract
The present disclosure is intended to provide a module in which connection reliability between a wiring substrate and an electronic component mounted on the wiring substrate can be improved. A module 1 includes a wiring substrate, an electronic component that is mounted on one principal surface of the wiring substrate, an underfill resin layer that is formed all over the one principal surface of the wiring substrate, and that is formed to fill up a gap between the one principal surface of the wiring substrate and the electronic component, and a molded resin layer that is formed to cover the underfill resin layer and the electronic component, wherein the underfill resin layer is formed of a resin containing a filler having a particle diameter that is smaller than a spacing between the one principal surface of the wiring substrate and the electronic component.
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