ELECTRONIC DEVICE WITH IMPROVED HEAT DISSIPATION
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United States of America Patent
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Issued Date -
Nov 5, 2015
app pub date -
Apr 28, 2015
filing date -
May 1, 2014
priority date (Note) -
Abandoned
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Abstract
An electronic device may include: a circuit board having a board surface; a heat-generating source including a first electronic component mounted on the board surface of the circuit board; and a heat dissipating panel stacked over the circuit board, having a panel surface, and formed with a first recess that is indented inwardly from the panel surface and that is defined by a first recess-defining wall. The first electronic component protrudes from the board surface into the first recess to contact the first recess-defining wall.
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