LIGHT EMITTING DIODE PACKAGE STRUCTURE
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United States of America Patent
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Issued Date -
Oct 29, 2015
app pub date -
Apr 28, 2015
filing date -
Apr 29, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A light emitting diode (LED) package structure including a carrier substrate, a LED and an electrostatic protection device is provided. The carrier substrate includes two leadframes separated from each other and a reflective member. The reflective member encapsulates the leadframes and exposes a carrier surface of each of the leadframes. The reflective member has a cavity, and a bottom surface of the cavity is aligned with the carrier surface of each of the leadframes. The LED is disposed inside the cavity and bridges the leadframes. The electrostatic protection device is disposed inside the cavity and bridges the leadframes. The LED is connected in anti-parallel to the electrostatic protection device.
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