SUBSTRATE TREATING APPARATUS
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United States of America Patent
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Issued Date -
Oct 29, 2015
app pub date -
Dec 24, 2014
filing date -
Apr 29, 2014
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Abstract
Provided is a substrate treating apparatus which treats a substrate using plasma. The substrate treating apparatus includes a processing chamber having an inner space in which process treatment is performed on a substrate, a cover member coupled to the processing chamber by a hinge part and rotating upwardly and downwardly with respect to the hinge part to open/close the processing chamber, and a close preventing member disposed on a sidewall of the cover member to prevent the cover member from being closed during upward rotation of the cover member.
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