METHOD OF DESIGNING CIRCUIT BOARD INSPECTING JIG, CIRCUIT BOARD INSPECTING JIG, AND CIRCUIT BOARD INSPECTING APPARATUS

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United States of America Patent

APP PUB NO 20150310161A1
SERIAL NO

14693134

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Abstract

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Provided is a method of designing a circuit board inspecting jig having a contact to be brought into conductive contact with a test point on a circuit board to be inspected. The method includes: preparing temporary design data by temporarily designing the circuit board inspecting jig based on design data for the circuit board to be inspected (a first designing process); acquiring an expansion and contraction ratio of the circuit board based on a condition upon manufacturing the circuit board (and an environmental condition upon inspecting the circuit board) (an expansion and contraction ratio acquiring process); and obtaining design data for the circuit board inspecting jig to be actually manufactured by scaling the temporary design data up and down by the expansion and contraction ratio (a second designing process).

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Patent Owner(s)

Patent OwnerAddress
NIDEC-READ CORPORATIONKYOTO-SHI KYOTO 615-0854

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
FUJINO, Makoto Kyoto, JP 75 796
HIKITA, Osamu Kyoto, JP 20 133
KAIDA, Michio Kyoto, JP 11 25
MATSUKAWA, Toshihide Kyoto, JP 11 12

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