METHOD OF FABRICATING A CONDUCTIVE PATTERN WITH HIGH OPTICAL TRANSMISSION, LOW REFLECTANCE, AND LOW VISIBILITY
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United States of America Patent
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Issued Date -
Oct 29, 2015
app pub date -
Apr 23, 2014
filing date -
Apr 23, 2014
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Abandoned
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Abstract
A method of fabricating a conductive pattern includes disposing an image of the conductive pattern on a substrate. The image includes material capable of being electroless plated. The image is electroless plated with a first metal forming a plated image. The first metal includes copper. The plated image is bathed in an immersion bath that includes a metal ion source of a second metal that reacts with the first metal. The second metal includes palladium. The conductive pattern includes a first metal layer having a first metal thickness, an intermetallic first metal-second metal interface layer, and a second metal layer having a second metal thickness.
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