RESIN COMPOSITION FOR SEALING ORGANIC ELECTRONICS DEVICES AND ORGANIC ELECTRONICS DEVICE
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United States of America Patent
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Oct 29, 2015
app pub date -
Nov 28, 2013
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Dec 10, 2012
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Abstract
An organic electronic device sealing resin composition including a block copolymer hydride obtained by hydrogenating 90% or more of all unsaturated bonds of a block copolymer, wherein the block copolymer includes: two or more polymer blocks [A] per one molecule of the copolymer, the block having an aromatic vinyl compound unit as a main component; and one or more polymer blocks [B] per one molecule of the copolymer, the block having a linear conjugated diene compound unit as a main component, and a ratio between a weight fraction wA of all the polymer blocks [A] in the entire block copolymer and a weight fraction wB of all the polymer blocks [B] in the entire block copolymer (wA:wB) is 20:80 to 60:40.
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