CHEMICAL MECHANICAL POLISHING PAD
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United States of America Patent
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Issued Date -
Oct 29, 2015
app pub date -
Apr 23, 2014
filing date -
Apr 23, 2014
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Abandoned
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Abstract
The present disclosure relates to a radiance decomposable CMP pad, and an associated method to refresh the CMP pad. In some embodiments, the CMP pad has a polymer layer and some macro pores disposed therein. A monomer of the polymer layer has a photoactive compound unit.
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