DIELECTRIC THERMAL PAD USING DUAL-SIDED THERMALLY CONDUCTIVE ADHESIVE ON CERAMIC
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United States of America Patent
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Oct 22, 2015
app pub date -
Apr 16, 2015
filing date -
Apr 16, 2014
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Abstract
A device includes: an electronic component that generates heat; a heatsink configured to absorb at least part of the heat through thermal transfer; and a thermally conductive dielectric pad that attaches the electronic component and the heatsink to each other and facilitates the thermal transfer. The thermally conductive dielectric pad includes: a ceramic tile; a first layer of adhesive that attaches a first side of the ceramic tile to the electronic component; and a second layer of adhesive that attaches a second side of the ceramic tile to the heatsink.
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