Semiconductor chip and semiconductor device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Sep 12, 2017
Issued Date -
N/A
app pub date -
Jun 30, 2015
filing date -
Nov 21, 2005
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A semiconductor device includes a first semiconductor chip operating at a first power supply voltage and a second semiconductor chip operating at a second power supply voltage lower than the first power supply voltage to supply the second power supply voltage to the first semiconductor chip. The semiconductor chips according to the present invention are conveniently used for fabrication of the semiconductor device. The first semiconductor chip includes an output circuit including a first transistor and a second transistor, interconnected in series and turned on or off complementarily. The output circuit outputs a signal to a first external output terminal. The first semiconductor chip also includes a third transistor connected in series with the first and second transistors and having a gate electrode connected to a second output terminal. The entire chip area is reduced, as compared with the case where plural semiconductor chips, operated at different operating voltages, are interconnected and used as such in a semiconductor device provided with an input/output buffer operating at a voltage different from the respective operating voltages resulting in an increased chip area.
First Claim
all claims..Other Claims data not available
Family
Country | kind | publication No. | Filing Date | Type | Sub-Type |
---|---|---|---|---|---|
JP | B2 | JP4776355 | Nov 21, 2005 | Patent | Grant |
Type : Patent Sub-Type : Grant | |||||
PUBLISHED GRANTED PATENT (SECOND LEVEL) | SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE | Sep 21, 2011 | |||
US | B2 | US7902873 | Nov 20, 2006 | Patent | Grant |
Type : Patent Sub-Type : Grant | |||||
GRANTED PATENT AS SECOND PUBLICATION | Semiconductor chip and semiconductor device | Mar 08, 2011 | |||
US | B2 | US8350593 | Jan 27, 2011 | Patent | Grant |
Type : Patent Sub-Type : Grant | |||||
GRANTED PATENT AS SECOND PUBLICATION | Semiconductor chip and semiconductor device | Jan 08, 2013 | |||
US | B2 | US9099330 | Jan 07, 2013 | Patent | Grant |
Type : Patent Sub-Type : Grant | |||||
GRANTED PATENT AS SECOND PUBLICATION | Semiconductor chip and semiconductor device | Aug 04, 2015 |
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
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RENESAS ELECTRONICS CORPORATION | 2-24 TOYOSU 3-CHOME KOUTOU-KU TOKYO 1350061 ?1350061 |
International Classification(s)

- 2015 Application Filing Year
- H03K Class
- 2401 Applications Filed
- 2055 Patents Issued To-Date
- 85.59 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
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Isozaki, Tomoaki | Kanagawa, JP | 8 | 66 |
# of filed Patents : 8 Total Citations : 66 |
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Patent Citation Ranking
- 0 Citation Count
- H03K Class
- 0 % this patent is cited more than
- 8 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Mar 12, 2025 |
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Mar 12, 2029 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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