Light Emitting Diode Assembly With Integrated Circuit Element
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United States of America Patent
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Issued Date -
Oct 22, 2015
app pub date -
Apr 18, 2014
filing date -
Apr 18, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An LED assembly with an ESD protection device integrated into the carrier substrate and a method for making the LED assembly is disclosed. In one embodiment, the LED assembly includes an LED in contact with a bonding layer in contact with a substrate. The substrate has a region containing a circuit element. The bonding layer forms an ohmic connection between the region containing the circuit element and the LED. In one embodiment, the region containing the circuit element is an ESD protection device, such as a Zener diode.
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