SYSTEMS AND METHODS FOR CARRYING SINGULATED DEVICE PACKAGES
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United States of America Patent
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Issued Date -
Oct 22, 2015
app pub date -
Apr 20, 2015
filing date -
Apr 22, 2014
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Abstract
In accordance with embodiments of the present disclosure, a method may include providing a substrate adapted for use in wafer processing equipment, wherein the substrate includes an adhesive applied thereto. The method may also include reconstituting a plurality of device packages onto the substrate. In accordance with these and other embodiments of the present disclosure, an apparatus may include a substrate adapted for use in wafer processing equipment, an adhesive applied to the substrate, and a plurality of device packages reconstituted onto the substrate.
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