INTEGRATED CIRCUIT CHIP AND DISPLAY APPARATUS
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United States of America Patent
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Issued Date -
Oct 22, 2015
app pub date -
Jun 20, 2014
filing date -
Jan 29, 2014
priority date (Note) -
Abandoned
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Abstract
Provided are an IC chip and a display apparatus. The IC chip (109) comprises several conductive metal sheets spaced from each other on one side of the IC chip, and conductive bumps (111) are formed on the conductive metal sheets. According to the present disclosure, since conductive bumps (111) are arranged on the conductive metal sheet of the IC chip (109), it is possible to use a non-conductive bonding layer such as NCF instead of ACF to bond the IC chip (109) to the display panel, and thus no metal particles would accumulate. As a result, the problem of short circuit or too large resistance will not occur. In addition, it is possible to reduce the production cost of the display apparatus by using NCF instead of ACF, facilitating industrialized manufacturing.
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