SILICON PRECURSOR, METHOD OF FORMING A LAYER USING THE SAME, AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME

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United States of America Patent

SERIAL NO

14602671

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Abstract

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The inventive concepts provide silicon precursors, methods of forming a layer using the same, and methods of fabricating a semiconductor device using the same. The silicon precursor includes a silane group including two or more silicon atoms. The silicon precursor has a high and uniform adsorption property on surfaces of layers (e.g., a silicon layer, an oxide layer, and a nitride layer) that are mainly used when semiconductor devices are fabricated.

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Patent Owner(s)

Patent OwnerAddress
DOW SILICONES CORPORATION2200 WEST SALZBURG ROAD MIDLAND MI 48686-0994

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cho, JunHyun Hwaseong-si, KR 4 27
Cho, Younjoung Hwaseong-si, KR 33 16
Jung, Kyunghye Nam-gu, KR 2 1
Telgenhoff, Michael David Midland, US 6 11
Zhou, Xiaobing Midland, US 46 101

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