Thermal Solutions and Methods for Dissipating Heat from Electronic Devices Using the Same Side of an Anisotropic Heat Spreader
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United States of America Patent
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Oct 22, 2015
app pub date -
Apr 16, 2015
filing date -
Apr 18, 2014
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Abstract
Example embodiments of the present disclosure generally relate to thermal solutions and methods for dissipating or removing heat from electronic devices using the same side of an anisotropic heat spreader. In an example embodiment, a thermal solution generally includes a heat removal structure and an anisotropic heat spreader. The anisotropic heat spreader is configured such that the heat removal structure and the heat source are in thermal contact with a same side of the anisotropic heat spreader and such that a thermally-conductive heat path is provided along that same side of the anisotropic heat spreader from the heat source to the heat removal structure. Heat from the heat source may be transferrable to the same side of the anisotropic heat spreader from which heat is also transferrable to the heat removal structure.
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