FOAMABLE COMPOSITION WITH LOW HEAT CONDUCTIVITY FOR USE IN PROFILED PLASTIC PARTS
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United States of America Patent
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Issued Date -
Oct 22, 2015
app pub date -
Mar 12, 2013
filing date -
Mar 20, 2012
priority date (Note) -
Abandoned
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Abstract
A foamable composition is described that includes at least one base polymer, at least one propellant, at least one lubricant and/or at least one heat stabilizer, and optionally additional additives, selected from crosslinking agents, heat reflectors, heat flow additives, anti-condensation additives, and/or fillers. Corresponding compositions can be processed into polymer foams which can have a heat conductivity of <0.04 E(mK), and an expansion greater than or equal to 1000%, and a weldability of 80 seconds at 240-260° C. Corresponding polymer foams can be advantageously introduced into hollow profiled plastic parts for windows and doors using a coextrusion process and can thus be used to produce door and window frames with low conductivity values.
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