MULTILAYER POLISHING PAD
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United States of America Patent
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Issued Date -
Oct 22, 2015
app pub date -
Oct 16, 2013
filing date -
Nov 8, 2012
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Abandoned
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Abstract
A multilayer polishing pad includes a cushion layer, an adhesive member, and a polishing layer placed on the cushion layer with the adhesive member interposed therebetween, wherein the adhesive member is an adhesive layer containing a polyester-based hot-melt adhesive or a double-sided tape including a base layer and the adhesive layer provided on each of both sides of the base layer, wherein the adhesive layer or the double-sided tape has a non-adhesive region that occupies 1 to 40% of the surface area, and the polyester-based hot-melt adhesive contains 100 parts by weight of a polyester resin as a base polymer and 2 to 10 parts by weight of an epoxy resin having two or more glycidyl groups per molecule.
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