SUBSTRATE TREATMENT DEVICE
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United States of America Patent
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Issued Date -
Oct 22, 2015
app pub date -
Apr 17, 2015
filing date -
Apr 18, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A substrate treatment device which can detect a metal film remaining as a residue on a polished surface of a substrate after polishing with high accuracy is provided. The substrate treatment device includes a polishing section 3 that polishes a surface to be polished of the substrate to remove the metal film formed on the surface to be polished, a cleaning section 4 that cleans and dries the substrate polished by the polishing section 3, and a temporary table 180 on which the substrate is temporarily placed after being polished by the polishing section 3. Sensors 8, 9 for detecting the metal film remaining on the polished surface of the substrate are provided at the temporary table 180.
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